Invention Grant
- Patent Title: Hole transport composition
- Patent Title (中): 空孔运输组成
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Application No.: US12467531Application Date: 2009-05-18
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Publication No.: US08343381B1Publication Date: 2013-01-01
- Inventor: Reid John Chesterfield
- Applicant: Reid John Chesterfield
- Applicant Address: US DE Wilmington
- Assignee: E I du Pont de Nemours and Company
- Current Assignee: E I du Pont de Nemours and Company
- Current Assignee Address: US DE Wilmington
- Main IPC: H01B1/00
- IPC: H01B1/00 ; H01L29/08 ; C08G73/00 ; H01J1/62
Abstract:
There is provided a hole transport composition having (i) a first hole transport polymer having crosslinkable groups, and (ii) a second hole transport polymer having substantially no crosslinkable groups. There is also provided a crosslinked hole transport layer and an electronic device containing the crosslinked hole transport layer.
Information query
