Invention Grant
- Patent Title: Electrostatic dissipative adhesive
- Patent Title (中): 静电消散胶
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Application No.: US12125012Application Date: 2008-05-21
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Publication No.: US08343386B2Publication Date: 2013-01-01
- Inventor: William Thomas Bandy, IV , Icko E. Tim Iben , Wayne Alan McKinley
- Applicant: William Thomas Bandy, IV , Icko E. Tim Iben , Wayne Alan McKinley
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Zilka-Kotab, PC
- Main IPC: H01B5/14
- IPC: H01B5/14 ; H01B1/00 ; H01L23/28 ; H01R11/01

Abstract:
An electrostatically dissipative adhesive in one embodiment includes a mixture comprising: an adhesive material; and electrically conductive particles intermixed with the adhesive material, the electrically conductive particles being present in an amount between 0 and about 10% by weight of a total weight of the mixture. An electrostatically dissipative adhesive in another embodiment includes a mixture comprising: an adhesive material; and electrically conductive particles intermixed with the adhesive material, the electrically conductive particles being present in an amount between 0 and about 10% by weight of a total weight of the mixture, wherein the mixture has at least 50% of a lap shear strength as measured in accordance with ISO 4587 after curing for 72 hours at 22° C. as the raw adhesive material has as measured in accordance with ISO 4587 after curing for 72 hours at 22° C.
Public/Granted literature
- US20090289231A1 ELECTROSTATIC DISSIPATIVE ADHESIVE Public/Granted day:2009-11-26
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