Invention Grant
- Patent Title: Microchip and method of using the same
- Patent Title (中): Microchip及其使用方法
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Application No.: US12257589Application Date: 2008-10-24
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Publication No.: US08343428B2Publication Date: 2013-01-01
- Inventor: Akinori Yokogawa , Toshihiro Mori
- Applicant: Akinori Yokogawa , Toshihiro Mori
- Applicant Address: JP Kyoto
- Assignee: Rohm Co., Ltd.
- Current Assignee: Rohm Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Fish & Richardson P.C.
- Priority: JP2007-280351 20071029; JP2007-285039 20071101; JP2007-285040 20071101
- Main IPC: G01N33/48
- IPC: G01N33/48 ; G01N21/00 ; G01N1/00 ; F15C1/06 ; B01L3/00 ; G01N9/30

Abstract:
A microchip including a first substrate with a groove formed on a substrate surface or a pass-through hole passing in a thickness direction of the substrate, and one or more second substrates laminated on a surface of the first substrate; the microchip including an optical measurement cuvette consisting of a space configured by the groove or the pass-through hole, and a substrate surface of the second substrate; wherein a side wall surface of the second substrate is positioned on an inner side than a side wall surface of the first substrate in at least one part of a side wall surface of the microchip, and a method of using the same are provided.
Public/Granted literature
- US20090111675A1 Microchip and Method of Using the Same Public/Granted day:2009-04-30
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