Invention Grant
- Patent Title: Organometallic compounds
- Patent Title (中): 有机金属化合物
-
Application No.: US12881896Application Date: 2010-09-14
-
Publication No.: US08343580B2Publication Date: 2013-01-01
- Inventor: Qing Min Wang , Deodatta Vinayak Shenai-Khatkhate , Huazhi Li
- Applicant: Qing Min Wang , Deodatta Vinayak Shenai-Khatkhate , Huazhi Li
- Applicant Address: US MA Marlborough
- Assignee: Rohm and Haas Electronic Materials LLC
- Current Assignee: Rohm and Haas Electronic Materials LLC
- Current Assignee Address: US MA Marlborough
- Agent S. Matthew Cairns
- Main IPC: C23C16/18
- IPC: C23C16/18 ; C23C18/44

Abstract:
Methods of vapor depositing metal-containing films using certain organometallic compounds containing a carbonyl-containing ligand are disclosed.
Public/Granted literature
- US20110064879A1 ORGANOMETALLIC COMPOUNDS Public/Granted day:2011-03-17
Information query
IPC分类: