Invention Grant
- Patent Title: Case module for portable terminal using thermal adhesive tape
- Patent Title (中): 使用热粘胶带的便携式终端壳体模块
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Application No.: US12795885Application Date: 2010-06-08
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Publication No.: US08343600B2Publication Date: 2013-01-01
- Inventor: Chang-Ki Son
- Applicant: Chang-Ki Son
- Applicant Address: KR
- Assignee: IL Shin Tech Co., Ltd.
- Current Assignee: IL Shin Tech Co., Ltd.
- Current Assignee Address: KR
- Agency: Cantor Colburn LLP
- Priority: KR10-2009-0081229 20090831
- Main IPC: B32B1/02
- IPC: B32B1/02 ; B32B23/00 ; B32B1/08

Abstract:
Disclosed is a case module for a portable terminal using a thermal adhesive tape. The portable terminal using a thermal adhesive tape includes: a case and a LCD cover of a portable terminal disposed so as to face with each other; a heated sheet made of a conductor and disposed between the case and the LCD cover; a first melting sheet adhered to a face of the heated sheet facing to the case; and a second melting sheet adhered to the other face of the heated sheet facing to the LCD cover, wherein the first sheet is melted to couple the heated sheet and the case to each other and the second sheet is melted to couple the heated sheet and the LCD cover to each other when the heated sheet is heated by a high frequency induction.
Public/Granted literature
- US20110052844A1 CASE MODULE FOR PORTABLE TERMINAL USING THERMAL ADHESIVE TAPE Public/Granted day:2011-03-03
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