Invention Grant
- Patent Title: Ceramic substrate
- Patent Title (中): 陶瓷基板
-
Application No.: US12691728Application Date: 2010-01-21
-
Publication No.: US08343617B2Publication Date: 2013-01-01
- Inventor: Yu-Hsin Yeh , Tzer-Shen Lin , Ren-Der Jean
- Applicant: Yu-Hsin Yeh , Tzer-Shen Lin , Ren-Der Jean
- Applicant Address: TW Hsinchu County
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu County
- Agency: Pai Patent & Trademark Law Firm
- Agent Chao-Chang David Pai
- Priority: TW98111795A 20090409; TW98141302A 20091203
- Main IPC: B32B3/00
- IPC: B32B3/00 ; B32B7/00 ; B32B17/00 ; B32B18/00
Abstract:
A Ceramic substrate is provided. The ceramic substrate includes a ceramic main body and a planar buffer layer on the ceramic main body. Further, the coefficient of thermal expansion of the ceramic main body CTEm and the coefficient of thermal expansion of the planar buffer layer CTEp satisfy the following mathematical relationship: |CTEm−CTEp|≦3×10−6/° C.
Public/Granted literature
- US20100260970A1 CERAMIC SUBSTRATE Public/Granted day:2010-10-14
Information query
