According to the present invention, formation of a compound material layer is carried out by a method that includes a step of forming a binder solution layer 56 by applying a binder solution 50 containing a binder 54 to a current collector 10, a step of depositing the binder solution layer 56 and a compound material paste layer 46 on the current collector 10 by applying a compound material paste 40 over the binder solution layer 56, and a step of obtaining an electrode in which the compound material layer is formed on the current collector 10 by drying both the binder solution layer 56 and the compound material paste layer 46. Here, the binder solution 56 has a binder solution non-coated region 58 where a surface 12 of the current collector 10 is exposed, and the drying is carried out in a state in which a portion of the compound material paste layer 46 is deposited on the current collector 10 in the binder solution non-coated region 58.