Invention Grant
- Patent Title: Positive resist composition and pattern forming method
- Patent Title (中): 正抗蚀剂组成和图案形成方法
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Application No.: US13228836Application Date: 2011-09-09
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Publication No.: US08343708B2Publication Date: 2013-01-01
- Inventor: Toshiaki Fukuhara , Hiromi Kanda , Shinichi Kanna
- Applicant: Toshiaki Fukuhara , Hiromi Kanda , Shinichi Kanna
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2007-085958 20070328; JP2008-076598 20080324
- Main IPC: G03F7/004
- IPC: G03F7/004 ; G03F7/028 ; G03F7/039 ; G03F7/26

Abstract:
A positive photosensitive composition includes: (A) a resin that has an acid decomposable repeating unit of formula (I) and increases its solubility in an alkali developer by action of an acid; (B) a compound that generates an acid upon irradiation; (C) a resin that has: a fluorine atom and/or a silicon atom; and a group selected from groups (x) to (z); and (D) a solvent: (x) an alkali soluble group, (y) a group which decomposes by action of an alkali developer and increases a solubility of the resin (C) in an alkali developer, and (z) a group which decomposes by action of an acid, wherein, Xa1 represents hydrogen, alkyl, cyano or halogen, Ry1 to Ry3 each independently represents alkyl or cycloalkyl, and at least two of Ry1 to Ry3 may be coupled to form a ring, and Z represents a divalent linking group.
Public/Granted literature
- US20120034564A1 POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD Public/Granted day:2012-02-09
Information query
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