Invention Grant
US08343780B2 Method of stressing a thin pattern 有权
强调薄图案的方法

Method of stressing a thin pattern
Abstract:
The invention relates to a method for straining or deforming a pattern or a thin layer (24), starting from an initial component comprising the said thin layer and a prestressed layer (20), this method comprising: an etching step of the prestressed layer, perpendicular to its surface.
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