Invention Grant
- Patent Title: LED module and packing method of the same
- Patent Title (中): LED模块和包装方法相同
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Application No.: US12879576Application Date: 2010-09-10
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Publication No.: US08343783B2Publication Date: 2013-01-01
- Inventor: Hao-An Lee
- Applicant: Hao-An Lee
- Applicant Address: TW Yongkang, Tainan County
- Assignee: Long Jing International Technology Enterprise Co., Ltd.
- Current Assignee: Long Jing International Technology Enterprise Co., Ltd.
- Current Assignee Address: TW Yongkang, Tainan County
- Agency: Muncy, Geissler, Olds & Lowe, PLLC
- Main IPC: H01L21/50
- IPC: H01L21/50

Abstract:
A LED module and a packing method of the same include plural boards defined with a positive line and a negative line. The positive line connects to at least one positive joint, and the negative line connects to at least one negative joint. Some LEDs are respectively disposed on each board, and conducting ends of the LEDs are separately connected to the positive line and the negative line. A number of electronic elements are individually installed on each board, and conducting ends of the electronic elements are separately connected to the positive line and the negative line disposed on the board. A positive guiding line connects to the positive joint of each board, and a negative guiding line connects to the negative joint of each board. The LED module achieved in accordance with above-mentioned construction contributes to the flexibility.
Public/Granted literature
- US20120061690A1 LED MODULE AND PACKING METHOD OF THE SAME Public/Granted day:2012-03-15
Information query
IPC分类: