Invention Grant
- Patent Title: Mems device and fabrication method
- Patent Title (中): 存储器件和制造方法
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Application No.: US13603007Application Date: 2012-09-04
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Publication No.: US08343805B1Publication Date: 2013-01-01
- Inventor: Clayton Lee Stevenson , Jason C. Green , Daryl Ross Koehl , Buu Quoc Diep
- Applicant: Clayton Lee Stevenson , Jason C. Green , Daryl Ross Koehl , Buu Quoc Diep
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Warren L. Franz; Wade J. Brady, III; Frederick J. Telecky, Jr.
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method and structure for uncovering captive devices in a bonded wafer assembly comprising a top wafer and a bottom wafer. One embodiment method includes forming a plurality of cuts in the top wafer and removing a segment of the top wafer defined by the plurality of cuts. The bottom wafer remains unsingulated after the removal of the segment.
Public/Granted literature
- US20120329180A1 MEMS DEVICE AND FABRICATION METHOD Public/Granted day:2012-12-27
Information query
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