Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US12984177Application Date: 2011-01-04
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Publication No.: US08343811B2Publication Date: 2013-01-01
- Inventor: Ralf Otremba
- Applicant: Ralf Otremba
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A module including a carrier and a semiconductor chip applied to the carrier. An external contact element is provided having a first portion and a second portion extending perpendicular to the first portion, wherein a thickness of the second portion is smaller than a thickness of the carrier.
Public/Granted literature
- US20110097855A1 SEMICONDUCTOR DEVICE Public/Granted day:2011-04-28
Information query
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