Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12923555Application Date: 2010-09-28
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Publication No.: US08343833B2Publication Date: 2013-01-01
- Inventor: Nobuki Miyakoshi
- Applicant: Nobuki Miyakoshi
- Applicant Address: JP Tokyo
- Assignee: Shindengen Electric Manufacturing Co., Ltd.
- Current Assignee: Shindengen Electric Manufacturing Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Nixon & Vanderhye P.C.
- Priority: JPP2006-330270 20061207
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
A semiconductor device including a plurality of units having identical structures, each unit includes: a drain electrode; a drift layer that includes a low concentration layer on the drain electrode and a reference concentration layer on the low concentration layer, a gate electrode on the reference concentration layer; a pair of source regions that are provided on an upper surface of the reference concentration layer and in the vicinity of both ends of the gate electrode; a pair of base regions that surround outer surfaces of the source regions; a source electrode electrically connected to the source regions and the base regions; and a pair of depletion-layer extension regions that are respectively provided under the base regions in the reference concentration region. Boundaries between the depletion-layer extension regions and the low concentration layer are positioned lower than a boundary between the reference concentration layer and the low concentration layer.
Public/Granted literature
- US20110039382A1 Semiconductor device and method for manufacturing the same Public/Granted day:2011-02-17
Information query
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