Invention Grant
- Patent Title: Semiconductor device with a charge carrier compensation structure in a semiconductor body and method for its production
- Patent Title (中): 具有半导体主体中的载流子补偿结构的半导体器件及其制造方法
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Application No.: US13327941Application Date: 2011-12-16
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Publication No.: US08343834B2Publication Date: 2013-01-01
- Inventor: Armin Willmeroth , Michael Rueb
- Applicant: Armin Willmeroth , Michael Rueb
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
A semiconductor device with a charge carrier compensation structure in a semiconductor body and to a method for its production. The semiconductor body includes drift zones of a first conduction type and charge compensation zones of a second conduction type complementing the first conduction type. The drift zones include a semiconductor material applied in epitaxial growth zones, wherein the epitaxial growth zones include an epitaxially grown semiconductor material which is non-doped to lightly doped. Towards the substrate, the epitaxial growth zones are provided with a first conduction type incorporated by ion implantation over the entire surface and with selectively introduced doping material zones of a second, complementary conduction type. Towards the front side, the epitaxial growth zones are provided with a second, complementary conduction type incorporated by ion implantation over the entire surface and with selectively introduced doping material zones of the first conduction type.
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