Invention Grant
- Patent Title: Manufacturing method of microcrystalline semiconductor film and manufacturing method of semiconductor device
- Patent Title (中): 微晶半导体薄膜的制造方法及半导体装置的制造方法
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Application No.: US13093174Application Date: 2011-04-25
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Publication No.: US08343857B2Publication Date: 2013-01-01
- Inventor: Satoshi Toriumi
- Applicant: Satoshi Toriumi
- Applicant Address: JP Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Nixon Peabody LLP
- Agent Jeffrey L. Costellia
- Priority: JP2010-102205 20100427
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
To provide a manufacturing method of a microcrystalline semiconductor film, the manufacturing method comprises the steps of forming a first semiconductor film over a substrate by generating plasma by performing continuous discharge under an atmosphere containing a deposition gas; forming a second semiconductor film over the first semiconductor film by generating plasma by performing pulsed discharge under the atmosphere containing the deposition gas; forming a third semiconductor film over the second semiconductor film by generating plasma by performing continuous discharge under the atmosphere containing the deposition gas; and forming a fourth semiconductor film over the third semiconductor film by generating plasma by performing pulsed discharge under the atmosphere containing the deposition gas.
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