Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
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Application No.: US12585034Application Date: 2009-09-01
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Publication No.: US08343870B2Publication Date: 2013-01-01
- Inventor: Atsuhiro Kinoshita , Junji Koga
- Applicant: Atsuhiro Kinoshita , Junji Koga
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Toshiba
- Current Assignee: Kabushiki Kaisha Toshiba
- Current Assignee Address: JP Tokyo
- Agency: Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- Priority: JP2006-171593 20060621
- Main IPC: H01L21/44
- IPC: H01L21/44

Abstract:
A semiconductor device which can effectively suppress a short channel effect and junction leakage is provided. A semiconductor device includes a field effect transistor. The field effect transistor includes a first semiconductor region of a first conductivity type, a gate electrode formed on a gate insulating film, and source and drain electrodes. The field effect transistor also includes second semiconductor regions of a second conductivity type. The field effect transistor further includes third semiconductor regions of the second conductivity type having an impurity concentration higher than that of the second semiconductor region and formed between the source electrode and the first and second semiconductor regions and between the drain electrode and the first and second semiconductor regions, and side wall insulating films formed on both the side surfaces of the gate electrode. The source electrode and the drain electrode are separated from the side wall insulating films.
Public/Granted literature
- US20090325357A1 Semiconductor device and method of manufacturing the same Public/Granted day:2009-12-31
Information query
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