Invention Grant
US08344048B2 Epoxy resin-forming liquid preparation containing inorganic particle
失效
含有无机颗粒的环氧树脂形成液体制剂
- Patent Title: Epoxy resin-forming liquid preparation containing inorganic particle
- Patent Title (中): 含有无机颗粒的环氧树脂形成液体制剂
-
Application No.: US12452388Application Date: 2008-07-11
-
Publication No.: US08344048B2Publication Date: 2013-01-01
- Inventor: Toshiaki Takeyama , Naohiko Suemura
- Applicant: Toshiaki Takeyama , Naohiko Suemura
- Applicant Address: JP Tokyo
- Assignee: Nissan Chemical Industries, Ltd.
- Current Assignee: Nissan Chemical Industries, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Priority: JP2007-182146 20070711
- International Application: PCT/JP2008/062604 WO 20080711
- International Announcement: WO2009/008509 WO 20090115
- Main IPC: C08L63/00
- IPC: C08L63/00 ; C08L63/06

Abstract:
There is provided a liquid preparation for forming an epoxy resin having curing properties combining high transparency and high bending strength while maintaining advantageous handling properties as in a liquid state. A liquid preparation for forming an epoxy resin comprising: an A agent; and a B agent; wherein the A agent contains a modified epoxy resin (I) formed from at least one type of compound (i) having in a molecule thereof, at least one functional group of Formula (1): (where R1 and R2 individually represent an alkyl group, an alkenyl group, an alkynyl group, an aryl group, an aralkyl group, a heterocyclic group or a halogenated, aminated or nitrated derivative of any of the groups) and a compound (ii) having a glycidyl group in a molecule thereof, and an inorganic particle (II); and the B agent contains a curing agent (III). A liquid preparation for forming an epoxy resin comprising: an A′ agent; and a B′ agent; wherein the A′ agent contains the modified epoxy resin (I); and the B′ agent contains the inorganic particle (II) and the curing agent (III).
Public/Granted literature
- US20100137475A1 EPOXY RESIN-FORMING LIQUID PREPARATION CONTAINING INORGANIC PARTICLE Public/Granted day:2010-06-03
Information query