Invention Grant
US08344259B2 Connection terminal, package using the same, and electronic apparatus
有权
连接端子,使用相同的封装,以及电子设备
- Patent Title: Connection terminal, package using the same, and electronic apparatus
- Patent Title (中): 连接端子,使用相同的封装,以及电子设备
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Application No.: US12739937Application Date: 2008-10-30
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Publication No.: US08344259B2Publication Date: 2013-01-01
- Inventor: Mahiro Tsujino
- Applicant: Mahiro Tsujino
- Applicant Address: JP Kyoto
- Assignee: Kyocera Corporation
- Current Assignee: Kyocera Corporation
- Current Assignee Address: JP Kyoto
- Agency: DLA Piper LLP (US)
- Priority: JP2007-281069 20071030; JP2007-308272 20071129
- International Application: PCT/JP2008/069749 WO 20081030
- International Announcement: WO2009/057691 WO 20090507
- Main IPC: H05K1/03
- IPC: H05K1/03

Abstract:
A connection terminal has, on an upper surface of a first dielectric layer, a first line conductor and a first grounding line conductor provided adjacent to both sides of the first line conductor, and has, on an upper surface of a third dielectric layer, a third line conductor and a third grounding line conductor provided adjacent to both sides of the third line conductor. These conductors are connected to a second line conductor and a second grounding line conductor provided adjacent to both sides of the second line conductor, respectively, the second line conductor and the second grounding line conductor being provided on an upper surface of a second dielectric layer. It is possible to obtain the connection terminal having a small size and capable of complying with a high-frequency signal.
Public/Granted literature
- US20100252313A1 Connection Terminal, Package Using the Same, and Electronic Apparatus Public/Granted day:2010-10-07
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