Invention Grant
US08344262B2 Epoxy resin composition for printed wiring board, resin composition varnish, prepreg, metal clad laminate, printed wiring board and multilayer printed wiring board
有权
印刷线路板用环氧树脂组合物，树脂组合物清漆，预浸料，金属包覆层压板，印刷线路板和多层印刷线路板
- Patent Title: Epoxy resin composition for printed wiring board, resin composition varnish, prepreg, metal clad laminate, printed wiring board and multilayer printed wiring board
- Patent Title (中): 印刷线路板用环氧树脂组合物，树脂组合物清漆，预浸料，金属包覆层压板，印刷线路板和多层印刷线路板
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Application No.: US12441422Application Date: 2006-09-14
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Publication No.: US08344262B2Publication Date: 2013-01-01
- Inventor: Hiroki Tamiya , Yoshihiko Nakamura , Shunji Araki , Eiji Imaizumi , Kentarou Fujino , Tomoaki Sawada , Takashi Shinpo
- Applicant: Hiroki Tamiya , Yoshihiko Nakamura , Shunji Araki , Eiji Imaizumi , Kentarou Fujino , Tomoaki Sawada , Takashi Shinpo
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: Greenblum & Bernstein, P.L.C.
- International Application: PCT/JP2006/318265 WO 20060914
- International Announcement: WO2008/032383 WO 20080320
- Main IPC: H05K1/00
- IPC: H05K1/00 ; B32B27/38 ; C08K5/00 ; C08L63/00
Abstract:
An epoxy resin composition for printed wiring board, characterized by containing (A) an epoxy resin component containing an epoxy resin (A-1) having nitrogen and bromine atoms in the same molecule, (B) a phenolic curing agent component containing a phenol resin (B-1), and (C) a curing accelerator component containing an imidazole-silane compound (C-1).
Public/Granted literature
Information query
