Invention Grant
- Patent Title: Semiconductor device and manufacturing process thereof
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12489818Application Date: 2009-06-23
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Publication No.: US08344264B2Publication Date: 2013-01-01
- Inventor: Yutaka Kumano , Hideki Iwaki , Tetsuyoshi Ogura , Shingo Komatsu , Koichi Hirano
- Applicant: Yutaka Kumano , Hideki Iwaki , Tetsuyoshi Ogura , Shingo Komatsu , Koichi Hirano
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2008-165425 20080625
- Main IPC: H05K1/11
- IPC: H05K1/11

Abstract:
A pair of discretionary points on a principal surface of a block are coupled to each other with a metal wire having a length larger than a distance between the pair of discretionary points, liquid resin is applied to the principal surface so as to cover the metal wire and then cured, so that a resin-cured material is formed, and the upper-surface portion of the resin-cured material is removed together with an intermediate portion of the metal wire, and then the block is removed from the resin-cured material.
Public/Granted literature
- US20090321124A1 SEMICONDUCTOR DEVICE AND MANUFACTURING PROCESS THEREOF Public/Granted day:2009-12-31
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