Invention Grant
- Patent Title: Electronic component, and a method of manufacturing an electronic component
- Patent Title (中): 电子部件，以及电子部件的制造方法
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Application No.: US12676393Application Date: 2008-08-29
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Publication No.: US08344349B2Publication Date: 2013-01-01
- Inventor: Friso Jacobus Jedema , Michael Antoine Armand in't Zandt
- Applicant: Friso Jacobus Jedema , Michael Antoine Armand in't Zandt
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: McClure, Qualey & Rodack, LLP
- Priority: EP07115899 20070907
- International Application: PCT/IB2008/053498 WO 20080829
- International Announcement: WO2009/031086 WO 20090312
- Main IPC: H01L47/00
- IPC: H01L47/00
Abstract:
Provided is an electronic component that includes a first bi-layer stack including a first silicon oxide layer and a first silicon nitride layer, a second bi-layer stack including a second silicon oxide layer and a second silicon nitride layer, and a convertible structure which is convertible between at least two states having different electrical properties, where the convertible structure is arranged between the first bi-layer stack and the second bi-layer stack.
Public/Granted literature
- US20110031462A1 Electronic Component, And A Method of Manufacturing An Electronic Component Public/Granted day:2011-02-10
Information query
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