Invention Grant
US08344399B2 LED package with wide emission range and effective heat dissipation
有权
LED封装，发射范围广，散热有效
- Patent Title: LED package with wide emission range and effective heat dissipation
- Patent Title (中): LED封装，发射范围广，散热有效
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Application No.: US12630477Application Date: 2009-12-03
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Publication No.: US08344399B2Publication Date: 2013-01-01
- Inventor: Hak Hwan Kim , Sung Kyong Oh , Soo Jin Jung , Hyung Kun Kim
- Applicant: Hak Hwan Kim , Sung Kyong Oh , Soo Jin Jung , Hyung Kun Kim
- Applicant Address: KR Seoul
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2008-0128885 20081217
- Main IPC: H01L33/00
- IPC: H01L33/00
Abstract:
There is provided an LED package including: a body unit; an LED chip mounted onto the body unit; lead frames mounted onto the body unit and electrically connected to the LED chip; and a reflection unit having a cavity to receive the LED chip therein and reflecting light emitted from the LED chip to the outside. Here, the reflection unit has a curved cross-section.
Public/Granted literature
- US20100148201A1 LED PACKAGE Public/Granted day:2010-06-17
Information query
IPC分类:
