Invention Grant
US08344408B2 Light emitting diode package having improved wire bonding structure
有权
具有改进的引线键合结构的发光二极管封装
- Patent Title: Light emitting diode package having improved wire bonding structure
- Patent Title (中): 具有改进的引线键合结构的发光二极管封装
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Application No.: US13149790Application Date: 2011-05-31
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Publication No.: US08344408B2Publication Date: 2013-01-01
- Inventor: Kai-Lun Wang , Shih-Yuan Hsu
- Applicant: Kai-Lun Wang , Shih-Yuan Hsu
- Applicant Address: TW Hsinchu Hsien
- Assignee: Advanced Optoelectronic Technology, Inc.
- Current Assignee: Advanced Optoelectronic Technology, Inc.
- Current Assignee Address: TW Hsinchu Hsien
- Agency: Altis Law Group, Inc.
- Priority: CN201010515529 20101021
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L27/15 ; H01L21/00
Abstract:
An exemplary light emitting diode (LED) package includes a substrate, an LED chip mounted on the substrate, and a wire. The LED chip includes a semiconductor structure and an electrode disposed on the semiconductor structure. The wire electrically connects the electrode of the LED chip to an electrical portion of the substrate. The wire has a first joint and a second joint connected to the substrate. The wire forms a first curved portion between the electrode and the first joint and a second curved portion between the first joint and the second joint.
Public/Granted literature
- US20120098003A1 LIGHT EMITTING DIODE PACKAGE Public/Granted day:2012-04-26
Information query
IPC分类:
