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US08344413B2 Nitride semiconductor wafer, nitride semiconductor chip, and method of manufacture of nitride semiconductor chip 有权
氮化物半导体晶片,氮化物半导体芯片以及氮化物半导体芯片的制造方法

Nitride semiconductor wafer, nitride semiconductor chip, and method of manufacture of nitride semiconductor chip
Abstract:
A nitride semiconductor chip is provided that offers enhanced luminous efficacy as a result of an improved EL emission pattern. The nitride semiconductor laser chip (nitride semiconductor chip) has an n-type GaN substrate having as a principal growth plane a plane having an off-angle in the a-axis direction relative to the m plane, and a nitride semiconductor layer formed on the principal growth plane of the n-type GaN substrate. The n-type GaN substrate includes a depressed portion (carved region), which is carved from the principal growth plane in the thickness direction, and an uncarved region, which is a region not carved. The nitride semiconductor layer formed on the n-type GaN substrate has a gradient thickness region whose thickness decreases in a gradient fashion toward the depressed portion (carved region) and an emission portion formation region whose thickness varies very little. In the emission portion formation region 6, a ridge portion is formed.
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