Invention Grant
US08344413B2 Nitride semiconductor wafer, nitride semiconductor chip, and method of manufacture of nitride semiconductor chip
有权
氮化物半导体晶片,氮化物半导体芯片以及氮化物半导体芯片的制造方法
- Patent Title: Nitride semiconductor wafer, nitride semiconductor chip, and method of manufacture of nitride semiconductor chip
- Patent Title (中): 氮化物半导体晶片,氮化物半导体芯片以及氮化物半导体芯片的制造方法
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Application No.: US12801218Application Date: 2010-05-27
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Publication No.: US08344413B2Publication Date: 2013-01-01
- Inventor: Takeshi Kamikawa , Masataka Ohta
- Applicant: Takeshi Kamikawa , Masataka Ohta
- Applicant Address: JP Osaka
- Assignee: Sharp Kabushiki Kaisha
- Current Assignee: Sharp Kabushiki Kaisha
- Current Assignee Address: JP Osaka
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2009-130741 20090529
- Main IPC: H01L33/00
- IPC: H01L33/00

Abstract:
A nitride semiconductor chip is provided that offers enhanced luminous efficacy as a result of an improved EL emission pattern. The nitride semiconductor laser chip (nitride semiconductor chip) has an n-type GaN substrate having as a principal growth plane a plane having an off-angle in the a-axis direction relative to the m plane, and a nitride semiconductor layer formed on the principal growth plane of the n-type GaN substrate. The n-type GaN substrate includes a depressed portion (carved region), which is carved from the principal growth plane in the thickness direction, and an uncarved region, which is a region not carved. The nitride semiconductor layer formed on the n-type GaN substrate has a gradient thickness region whose thickness decreases in a gradient fashion toward the depressed portion (carved region) and an emission portion formation region whose thickness varies very little. In the emission portion formation region 6, a ridge portion is formed.
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