Invention Grant
- Patent Title: Nanopillar E-fuse structure and process
- Patent Title (中): 纳米棒电子熔丝结构及工艺
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Application No.: US12627747Application Date: 2009-11-30
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Publication No.: US08344428B2Publication Date: 2013-01-01
- Inventor: Satya N. Chakravarti , Dechao Guo , Huiming Bu , Keith Kwong Hon Wong
- Applicant: Satya N. Chakravarti , Dechao Guo , Huiming Bu , Keith Kwong Hon Wong
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Michael J. Chang, LLC
- Agent Vazken Alexanian
- Main IPC: H01L23/52
- IPC: H01L23/52

Abstract:
Techniques for incorporating nanotechnology into electronic fuse (e-fuse) designs are provided. In one aspect, an e-fuse structure is provided. The e-fuse structure includes a first electrode; a dielectric layer on the first electrode having a plurality of nanochannels therein; an array of metal silicide nanopillars that fill the nanochannels in the dielectric layer, each nanopillar in the array serving as an e-fuse element; and a second electrode in contact with the array of metal silicide nanopillars opposite the first electrode. Methods for fabricating the e-fuse structure are also provided as are semiconductor devices incorporating the e-fuse structure.
Public/Granted literature
- US20110127637A1 Nanopillar E-Fuse Structure and Process Public/Granted day:2011-06-02
Information query
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