Invention Grant
- Patent Title: Semiconductor device having an edge termination structure and method of manufacture thereof
- Patent Title (中): 具有边缘端接结构的半导体器件及其制造方法
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Application No.: US10561531Application Date: 2004-05-21
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Publication No.: US08344448B2Publication Date: 2013-01-01
- Inventor: Raymond J. Grover
- Applicant: Raymond J. Grover
- Applicant Address: NL Eindhoven
- Assignee: NXP B.V.
- Current Assignee: NXP B.V.
- Current Assignee Address: NL Eindhoven
- Priority: GB0312512.7 20030531
- International Application: PCT/IB2004/001779 WO 20040521
- International Announcement: WO2004/107448 WO 20041209
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
A semiconductor device having a semiconductor body comprising an active area and a termination structure surrounding the active area, and a method for the manufacture thereof. The invention particularly concerns a termination structure for such devices having trenched electrodes in the active area. The termination structure comprises a plurality of lateral trench-gate transistor devices connected in series and extending from the active area towards a peripheral edge of the semiconductor body. The lateral devices are arranged such that a voltage difference between the active area and the peripheral edge is distributed across the lateral devices. The termination structure is compact and features of the structure are susceptible for formation in the same process steps as features of the active area.
Public/Granted literature
- US20110291185A1 Semiconductor Device Having an Edge Termination Structure and Method of Manufacture Thereof Public/Granted day:2011-12-01
Information query
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