Invention Grant
- Patent Title: Semiconductor device with buried bit lines and method for fabricating the same
- Patent Title (中): 具有掩埋位线的半导体器件及其制造方法
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Application No.: US13541213Application Date: 2012-07-03
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Publication No.: US08344450B2Publication Date: 2013-01-01
- Inventor: Su-Young Kim
- Applicant: Su-Young Kim
- Applicant Address: KR Gyeonggi-do
- Assignee: Hynix Semiconductor Inc.
- Current Assignee: Hynix Semiconductor Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: IP & T Group LLP
- Priority: KR10-2009-0117433 20091130; KR10-2010-0051196 20100531
- Main IPC: H01L29/94
- IPC: H01L29/94

Abstract:
A semiconductor device includes: a semiconductor substrate configured to include a plurality of trenches therein; a plurality of buried bit lines each configured to fill a portion of each trench; a plurality of active pillars each formed in an upper portion of each buried bit line; a plurality of vertical gates each configured to surround each active pillar; and a plurality of word lines configured to couple neighboring vertical gates with each other.
Public/Granted literature
- US20120267723A1 SEMICONDUCTOR DEVICE WITH BURIED BIT LINES AND METHOD FOR FABRICATING THE SAME Public/Granted day:2012-10-25
Information query
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