Invention Grant
- Patent Title: Solid-state imaging device and manufacturing method for the same
- Patent Title (中): 固态成像装置及其制造方法相同
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Application No.: US12893565Application Date: 2010-09-29
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Publication No.: US08344461B2Publication Date: 2013-01-01
- Inventor: Tomotsugu Takeda
- Applicant: Tomotsugu Takeda
- Applicant Address: JP Osaka
- Assignee: Panasonic Corporation
- Current Assignee: Panasonic Corporation
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2009-223755 20090929
- Main IPC: H01L21/02
- IPC: H01L21/02

Abstract:
A MOS solid-state imaging device having: a semiconductor substrate provided with a pair of source and drain regions in a pixel area, the pair of source and drain regions constituting part of a transistor in the pixel area; an insulating film formed over the semiconductor substrate; a wiring layer formed over the insulating film; and a contact plug penetrating through the insulating film to connect either one of the pair of source and drain regions with the wiring layer, wherein a surface area of said one of the pair of source and drain regions is silicided, the surface area contacting with the contact plug, and a width of the surface area is equal to a width of the contact plug.
Public/Granted literature
- US20110073971A1 SOLID-STATE IMAGING DEVICE AND MANUFACTURING METHOD FOR THE SAME Public/Granted day:2011-03-31
Information query
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