Invention Grant
- Patent Title: Integrated circuit inductor with integrated vias
- Patent Title (中): 具集成通孔的集成电路电感
-
Application No.: US13027903Application Date: 2011-02-15
-
Publication No.: US08344479B2Publication Date: 2013-01-01
- Inventor: Robert L. Pitts , Greg C. Baldwin
- Applicant: Robert L. Pitts , Greg C. Baldwin
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Warren L. Franz; Wade J. Brady, III; Frederick J. Telecky, Jr.
- Main IPC: H01L27/08
- IPC: H01L27/08

Abstract:
Integrated circuit inductors (5) are formed by interconnecting various metal layers (10) in an integrated circuit with continuous vias (200). Using continuous vias (200) improves the Q factor over existing methods for high frequency applications. The contiguous length of the continuous vias should be greater than three percent of the length of the inductor (5).
Public/Granted literature
- US20110133880A1 INTEGRATED CIRCUIT INDUCTOR WITH INTEGRATED VIAS Public/Granted day:2011-06-09
Information query
IPC分类: