Invention Grant
- Patent Title: Bipolar transistors with hump regions
- Patent Title (中): 具有隆起区域的双极晶体管
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Application No.: US13041531Application Date: 2011-03-07
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Publication No.: US08344481B2Publication Date: 2013-01-01
- Inventor: Xin Lin , Bernhard H. Grote , Hongning Yang , Jiang-Kai Zuo
- Applicant: Xin Lin , Bernhard H. Grote , Hongning Yang , Jiang-Kai Zuo
- Applicant Address: US TX Austin
- Assignee: Freescale Semiconductor, Inc.
- Current Assignee: Freescale Semiconductor, Inc.
- Current Assignee Address: US TX Austin
- Agency: Ingrassia Fisher & Lorenz, P.C.
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
By providing a novel bipolar device design implementation, a standard CMOS process can be used unchanged to fabricate useful bipolar transistors and other bipolar devices having adjustable properties by partially blocking the P or N well doping used for the transistor base. This provides a hump-shaped base region with an adjustable base width, thereby achieving, for example, higher gain than can be obtained with the unmodified CMOS process alone. By further partially blocking the source/drain doping step used to form the emitter of the bipolar transistor, the emitter shape and effective base width can be further varied to provide additional control over the bipolar device properties. The embodiments thus include prescribed modifications to the masks associated with the bipolar device that are configured to obtain desired device properties. The CMOS process steps and flow are otherwise unaltered and no additional process steps are required.
Public/Granted literature
- US20110147893A1 BIPOLAR TRANSISTORS WITH HUMP REGIONS Public/Granted day:2011-06-23
Information query
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