Invention Grant
- Patent Title: Integrated chip carrier with compliant interconnects
- Patent Title (中): 集成芯片载体兼容互连
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Application No.: US12986460Application Date: 2011-01-07
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Publication No.: US08344516B2Publication Date: 2013-01-01
- Inventor: Timothy J. Chainer
- Applicant: Timothy J. Chainer
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Michael J. Buchenhorner; Vazken Alexanian
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/48 ; H01L29/40
Abstract:
A silicon chip includes a silicon substrate, a plurality of pads, and a plurality of through vias to connect back-end-of-line wiring to the plurality of pads. The silicon substrate includes a layer of active devices and the back-end-of-line wiring connected to the active devices.
Public/Granted literature
- US20110101540A1 INTEGRATED CHIP CARRIER WITH COMPLIANT INTERCONNECTS Public/Granted day:2011-05-05
Information query
IPC分类:
