Invention Grant
- Patent Title: Bus-tie SSPCS for DC power distribution system
- Patent Title (中): 用于直流配电系统的总线SSPCS
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Application No.: US12783092Application Date: 2010-05-19
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Publication No.: US08344544B2Publication Date: 2013-01-01
- Inventor: Gregory I. Rozman , Joshua C. Swenson
- Applicant: Gregory I. Rozman , Joshua C. Swenson
- Applicant Address: US CT Windsor Locks
- Assignee: Hamilton Sundstrand Corporation
- Current Assignee: Hamilton Sundstrand Corporation
- Current Assignee Address: US CT Windsor Locks
- Agency: Cantor Colburn LLP
- Main IPC: H02J1/10
- IPC: H02J1/10

Abstract:
A direct current (DC) power distribution system includes a first electrical distribution and power management (EDPM) unit including a first DC power source connected to a first high voltage DC bus connected to a first DC load, and a first bus-tie solid state power controller (SSPC) connected to the first HVDC bus; a second EDPM unit including a second DC power source connected to a second high voltage DC bus connected to a second DC load, and a second bus-tie SSPC being connected to the second HVDC bus; and a bus-tie connected between the first bus-tie SSPC and the second bus-tie SSPC, wherein in the event a power source failure occurs in the first EDPM unit, power flows from the second DC power source to the first HVDC bus via the second bus-tie SSPC, the bus-tie, and the first bus-tie SSPC.
Public/Granted literature
- US20110285202A1 Bus-Tie SSPCS for DC Power Distribution System Public/Granted day:2011-11-24
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