Invention Grant
- Patent Title: Boundary acoustic wave device
- Patent Title (中): 边界声波装置
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Application No.: US13368361Application Date: 2012-02-08
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Publication No.: US08344589B2Publication Date: 2013-01-01
- Inventor: Mari Yaoi , Tetsuya Kimura
- Applicant: Mari Yaoi , Tetsuya Kimura
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2009-185790 20090810; JP2009-191861 20090828
- Main IPC: H01L41/08
- IPC: H01L41/08

Abstract:
Regarding a boundary acoustic wave device in which at least a part of an IDT electrode is embedded in a groove disposed in a piezoelectric substrate, the acoustic velocity is increased. A boundary acoustic wave device is provided with a piezoelectric substrate, a first dielectric layer, and an IDT electrode. The surface of the piezoelectric substrate is provided with a groove. The IDT electrode is disposed at the boundary between the piezoelectric substrate and the first dielectric layer in such a way that at least a part thereof is located in the groove. In the inside of the groove, the groove angle γ, which is the size of an angle formed by an upper end portion of the inside surface of the groove with the surface of the piezoelectric substrate, is less than 90 degrees.
Public/Granted literature
- US20120133246A1 BOUNDARY ACOUSTIC WAVE DEVICE Public/Granted day:2012-05-31
Information query
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