Invention Grant
US08344600B2 Heat dissipating structure of LED circuit board and LED lamp tube comprised thereof
有权
LED电路板的散热结构及其组成的LED灯管
- Patent Title: Heat dissipating structure of LED circuit board and LED lamp tube comprised thereof
- Patent Title (中): LED电路板的散热结构及其组成的LED灯管
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Application No.: US12211965Application Date: 2008-09-17
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Publication No.: US08344600B2Publication Date: 2013-01-01
- Inventor: Kuo-Len Lin , Chen-Hsiang Lin , Hwai-Ming Wang , Ken Hsu , Chih-Hung Cheng
- Applicant: Kuo-Len Lin , Chen-Hsiang Lin , Hwai-Ming Wang , Ken Hsu , Chih-Hung Cheng
- Applicant Address: TW New Taipei TW New Taipei
- Assignee: CPUMate Inc.,Golden Sun News Techniques Co., Ltd.
- Current Assignee: CPUMate Inc.,Golden Sun News Techniques Co., Ltd.
- Current Assignee Address: TW New Taipei TW New Taipei
- Agency: HDLS IPR Services
- Agent Chun-Ming Shih
- Main IPC: H01J1/02
- IPC: H01J1/02
Abstract:
A heat dissipating structure of an LED circuit board includes an LED circuit board having a plurality of soldering points. The soldering points of the LED circuit board are covered by a coating layer including Nanoparticles and a bonding agent. The LED circuit board is covered by the coating layer in an LED lamp tube to accelerate dissipating the heat of the LED circuit board. The coating layer has the characteristics of high emitting rate, temperature resistance, and conductivity insulation. On the other hand, the coating layer can increase the contacting areas of the soldering points with the air to enlarge the heat dissipation area of the LED circuit board to, thereby accelerating dissipating the heat.
Public/Granted literature
- US20100066230A1 HEAT DISSIPATING STRUCTURE OF LED CIRCUIT BOARD AND LED LAMP TUBE COMPRISED THEREOF Public/Granted day:2010-03-18
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