A resin molding device includes a lead plate and a first resin molding member. The lead plate includes patterns. Each of the patterns includes a base, a plurality of lead pairs; and a lead connection portion. Each of the lead pairs includes a first lead and a second lead. The first resin molding member is integrally formed with the base and the lead pairs. The first resin molding member defines a recessed portion at a mounting side surface on the base where a light emitting device is to be mounted. The recessed portion is formed to open upwardly and to have a side surface. The lead pairs are partially exposed at a bottom surface area of the recessed portion. The first lead or the second lead is capable of mounting a protection device thereon such that the protection device is covered by the first resin molding member.