Invention Grant
- Patent Title: Test module for radio frequency identification chips and method of the same
- Patent Title (中): 射频识别芯片的测试模块及其方法
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Application No.: US12574372Application Date: 2009-10-06
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Publication No.: US08344734B2Publication Date: 2013-01-01
- Inventor: Lu-Chen Hwan
- Applicant: Lu-Chen Hwan
- Applicant Address: TW Taipei County, Xinzhuang
- Assignee: Mutual-Pak Technology Co., Ltd.
- Current Assignee: Mutual-Pak Technology Co., Ltd.
- Current Assignee Address: TW Taipei County, Xinzhuang
- Agency: Snell & Wilmer L.L.P.
- Priority: TW97138960A 20081009
- Main IPC: G01R31/02
- IPC: G01R31/02

Abstract:
A test module and method for radio frequency identification (RFID) chips are provided. The test module includes a test head having a chip carrier for carrying a RFID chip to be tested, the chip carrier having a first antenna electronically connecting the RFID chip. The module further includes a second antenna for communicating with the first antenna; and a base supporting the chip carrier and the second antenna. The test module further includes a test computer electronically connecting the second antenna, wherein the test computer evaluates functions of the RFID chip by way of the communications between the first antenna and the second antenna.
Public/Granted literature
- US20100090707A1 TEST MODULE FOR RADIO FREQUENCY IDENTIFICATION CHIPS AND METHOD OF THE SAME Public/Granted day:2010-04-15
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