Invention Grant
- Patent Title: Probe station for on-wafer-measurement under EMI-shielding
- Patent Title (中): 探测台用于EMI屏蔽下的晶圆测量
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Application No.: US12818442Application Date: 2010-06-18
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Publication No.: US08344744B2Publication Date: 2013-01-01
- Inventor: Axel Schmidt , Botho Hirschfeld , Stojan Kanev , Andrej Rumiantsev , Michael Teich
- Applicant: Axel Schmidt , Botho Hirschfeld , Stojan Kanev , Andrej Rumiantsev , Michael Teich
- Applicant Address: US OR Beaverton
- Assignee: Cascade Microtech, Inc.
- Current Assignee: Cascade Microtech, Inc.
- Current Assignee Address: US OR Beaverton
- Agency: DASCENZO Intellectual Property Law, P.C.
- Priority: DE202010003817U 20100318
- Main IPC: G01R31/00
- IPC: G01R31/00

Abstract:
An arrangement is provided for testing DUTs with a chuck that has a support surface for supporting of a DUT as well as for supplying the support surface with a defined potential, or for connecting the DUT. The arrangement further includes a positioning device for positioning the chuck as well as an electromagnetic shielding housing enclosing at least the chuck. Inside the housing and adjacent to the chuck, a signal preamplifier is arranged whose signal port facing the chuck is electrically connected with the support surface, wherein the signal preamplifier is moveable together with the chuck by the positioning device in a way that it holds its position constant relative to the chuck during positioning. The signal preamplifier is connected to a measurement unit outside of the housing via a measurement cable.
Public/Granted literature
- US20110227602A1 PROBE STATION FOR ON-WAFER-MEASUREMENT UNDER EMI-SHIELDING Public/Granted day:2011-09-22
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