Invention Grant
- Patent Title: Multi-chip package
- Patent Title (中): 多芯片封装
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Application No.: US12982544Application Date: 2010-12-30
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Publication No.: US08344754B2Publication Date: 2013-01-01
- Inventor: Kyoung Nam Kim , Beom Ju Shin
- Applicant: Kyoung Nam Kim , Beom Ju Shin
- Applicant Address: KR Gyeonggi-do
- Assignee: Hynix Semiconductor Inc.
- Current Assignee: Hynix Semiconductor Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: IP & T Group LLP
- Priority: KR10-2010-0075250 20100804
- Main IPC: H03K17/16
- IPC: H03K17/16 ; H03K19/0175 ; H03B1/00
Abstract:
A multi-chip package includes a plurality of chips coupled in parallel to an I/O pad and an output driver circuit included in each of the chips and configured to transmit output data to the I/O pad. The driving force of the output driver circuit is controlled on the basis of stack information indicative of the number of chips being activated.
Public/Granted literature
- US20120032706A1 MULTI-CHIP PACKAGE Public/Granted day:2012-02-09
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