Invention Grant
- Patent Title: Conformal reference planes in substrates
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Application No.: US12259775Application Date: 2008-10-28
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Publication No.: US08344819B2Publication Date: 2013-01-01
- Inventor: Sampath Komarapalayam Velayudham Karikalan
- Applicant: Sampath Komarapalayam Velayudham Karikalan
- Applicant Address: US CA Irvine
- Assignee: Broadcom Corporation
- Current Assignee: Broadcom Corporation
- Current Assignee Address: US CA Irvine
- Agency: Fiala & Weaver P.L.L.C.
- Main IPC: H01P3/08
- IPC: H01P3/08

Abstract:
Methods, systems, and apparatuses for circuit boards are provided herein. An electrically insulating material is formed over one or more traces on a circuit board. One or more further electrically conductive features are present on the circuit board. A layer of an electrically conductive material is formed over the one or more traces that is electrically isolated from the one or more traces by the electrically insulating material, and is in electrical contact with the one or more further electrically conductive features. The electrically conductive material confines magnetic and electric fields produced when the one or more traces conduct an alternating current. By confining the magnetic and electric field distributions in this manner, problems of interference and/or crosstalk with adjacent signal traces are reduced or eliminated.
Public/Granted literature
- US20100102903A1 CONFORMAL REFERENCE PLANES IN SUBSTRATES Public/Granted day:2010-04-29
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