Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US11892568Application Date: 2007-08-24
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Publication No.: US08344888B2Publication Date: 2013-01-01
- Inventor: Takeshi Osada , Hikaru Tamura
- Applicant: Takeshi Osada , Hikaru Tamura
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2006-236928 20060831
- Main IPC: G08B13/14
- IPC: G08B13/14

Abstract:
The semiconductor device includes a signal processing circuit, an antenna circuit that is connected to the signal processing circuit, and a storage means that supplies electric power to the signal processing circuit. The signal processing circuit receives and transmits information through the antenna circuit, generates a direct current voltage from signals received by the antenna circuit, and stores the direct current voltage in the storage means. Furthermore, the antenna circuit has an antenna portion that receives signals by an electromagnetic induction method and an antenna portion that receives signals by a microwave method so that signals of frequencies from a wide band can be received. Because signals from a wide band can be received, the environment in which the storage means can be charged is widened.
Public/Granted literature
- US20080055047A1 Semiconductor device Public/Granted day:2008-03-06
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