Invention Grant
- Patent Title: Integrated antenna with e-flex technology
- Patent Title (中): 集成天线与e-flex技术
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Application No.: US12655839Application Date: 2010-01-08
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Publication No.: US08344955B2Publication Date: 2013-01-01
- Inventor: Ian Sakari Niemi
- Applicant: Ian Sakari Niemi
- Applicant Address: FI Espoo
- Assignee: Nokia Corporation
- Current Assignee: Nokia Corporation
- Current Assignee Address: FI Espoo
- Agency: Harrington & Smith
- Main IPC: H01Q1/24
- IPC: H01Q1/24

Abstract:
A first printed wiring board PWB includes a core and a power layer and a ground layer. A second PWB includes a flexible portion that is partially embedded within an end section of the first printed wiring board and abutting the core. The flexible portion includes a first layer having an antenna feed coupled to the power layer of the core, and a second layer. In a particular embodiment, the second PWB also includes a rigid section in which an opposed end of the flexible portion is also partially embedded.
Public/Granted literature
- US20110169698A1 Integrated antenna with e-flex technology Public/Granted day:2011-07-14
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