An electronic device including: a thin-film substrate having a front surface being formed with electronic circuits; an adhesive layer comprising an adhesive material applied to a back surface of the thin-film substrate, the adhesive material having an elasticity modulus being in a range of 1.0×103 to 2.1×104 Pa at 80° C.; and a flexible substrate having a front surface being bonded to the back surface of the thin-film substrate with the adhesive layer.