Invention Grant
- Patent Title: Aberration measurement method, exposure apparatus, and device manufacturing method
- Patent Title (中): 畸变测量方法,曝光装置和装置制造方法
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Application No.: US12043578Application Date: 2008-03-06
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Publication No.: US08345220B2Publication Date: 2013-01-01
- Inventor: Hironori Maeda
- Applicant: Hironori Maeda
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Canon U.S.A., Inc. IP Division
- Priority: JP2007-086469 20070329
- Main IPC: G03B27/52
- IPC: G03B27/52 ; G03B27/68

Abstract:
A method for measuring a spherical aberration or a coma aberration of a projection optical system of an exposure apparatus configured to transfer an image of a pattern formed on an original plate onto a substrate through the projection optical system. The method for measuring the spherical aberration includes obtaining a focal position of the projection optical system under a first measurement condition, obtaining a focal position of the projection optical system under a second measurement condition different from the first measurement condition, and measuring the spherical aberration of the projection optical system based on a difference of the focal position obtained under the first and the second measurement conditions.
Public/Granted literature
- US20080239271A1 ABERRATION MEASUREMENT METHOD, EXPOSURE APPARATUS, AND DEVICE MANUFACTURING METHOD Public/Granted day:2008-10-02
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