Invention Grant
- Patent Title: Inspection apparatus and inspection method
- Patent Title (中): 检验仪器和检验方法
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Application No.: US13312663Application Date: 2011-12-06
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Publication No.: US08345233B2Publication Date: 2013-01-01
- Inventor: Tadashi Suga , Shuichi Chikamatsu , Masayuki Ochi , Takahiko Suzuki , Seiji Otani
- Applicant: Tadashi Suga , Shuichi Chikamatsu , Masayuki Ochi , Takahiko Suzuki , Seiji Otani
- Applicant Address: JP Tokyo
- Assignee: Hitachi High-Technologies Corporation
- Current Assignee: Hitachi High-Technologies Corporation
- Current Assignee Address: JP Tokyo
- Agency: McDermott Will & Emery LLP
- Priority: JP2006-180638 20060630; JP2007-092779 20070330
- Main IPC: G01N21/00
- IPC: G01N21/00

Abstract:
A defect inspection apparatus emits light to a test object, detects reflected of scattered light from the test object and detects a defect in the test object The apparatus comprises a temperature-controlled part accommodating section that accommodates parts having a need for controlling a temperature, which is out of a plurality of parts in the defect inspection apparatus. A first temperature measuring instrument measures a temperature in the temperature-controlled part accommodating section; and a temperature control unit controls a temperature of the interior of the temperature-controlled part accommodating section at a prescribed temperature according to the temperature measured by the first temperature measuring instrument. Accordingly, a defect inspection apparatus can efficiently perform temperature control without involving an enlarged size can be achieved.
Public/Granted literature
- US20120140212A1 INSPECTION APPARATUS AND INSPECTION METHOD Public/Granted day:2012-06-07
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