Invention Grant
- Patent Title: Connection structure and connection method of wiring board
- Patent Title (中): 接线板的连接结构和连接方法
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Application No.: US13073666Application Date: 2011-03-28
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Publication No.: US08345437B2Publication Date: 2013-01-01
- Inventor: Tomoyuki Kubo , Yuji Shinkai
- Applicant: Tomoyuki Kubo , Yuji Shinkai
- Applicant Address: JP Aichi-ken
- Assignee: Brother Kogyo Kabushiki Kaisha
- Current Assignee: Brother Kogyo Kabushiki Kaisha
- Current Assignee Address: JP Aichi-ken
- Agency: Scully, Scott, Murphy & Presser, PC
- Priority: JP2010-210420 20100921
- Main IPC: H05K7/00
- IPC: H05K7/00

Abstract:
A connection structure for connecting a wiring board to a to-be-connected body having electric contacts, the wiring board including: a base having board-side contacts provided on its facing surface that is to face the to-be-connected body; and a cover film which covers the facing surface except the board-side contacts and a non-covered partial region of the facing surface, the connection structure including: conduction portions formed of electrically conductive resin, for bonding the electric contacts and the board-side contacts to permit electrical conduction therebetween; and a reinforcement portion formed of the same resin as the conduction portions and disposed at a position which is different from positions of the conductive portions and at which the reinforcement portion extends across both of a surface of the cover film and a surface of the non-covered partial region of the base, the reinforcement portion bonding the to-be-connected body and the wiring board for reinforcing connection therebetween.
Public/Granted literature
- US20120067624A1 CONNECTION STRUCTURE AND CONNECTION METHOD OF WIRING BOARD Public/Granted day:2012-03-22
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