Invention Grant
- Patent Title: Industrial module assembling apparatus
- Patent Title (中): 工业模块组装装置
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Application No.: US12647075Application Date: 2009-12-24
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Publication No.: US08345440B2Publication Date: 2013-01-01
- Inventor: Yuh Lin Wu , Lih Guong Jang , Hsiao Hu Tan
- Applicant: Yuh Lin Wu , Lih Guong Jang , Hsiao Hu Tan
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: Egbert Law Offices, PLLC
- Priority: TW98130481A 20090910
- Main IPC: H05K1/14
- IPC: H05K1/14

Abstract:
An industrial module apparatus includes a frame, a module signal integrated backplane, a plurality of function modules and a module terminal panel. The module signal integrated backplane is disposed at a side of the frame. The function modules can be inserted into the frame and electrically connected to the module signal integrated backplane for signal transmission, and can be removed from the frame for replacement. The function modules include a video analysis module, a network module, and/or a sensing module. The module terminal panel is connected to the module signal integrated backplane and serves as a signal transmission port for the function modules.
Public/Granted literature
- US20110058341A1 INDUSTRIAL MODULE APPARATUS Public/Granted day:2011-03-10
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