Invention Grant
- Patent Title: Heat sink assembly for a pluggable module
- Patent Title (中): 用于可插拔模块的散热器组件
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Application No.: US12952463Application Date: 2010-11-23
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Publication No.: US08345445B2Publication Date: 2013-01-01
- Inventor: Stephen D Del Prete , Robert Stratton , David A. Dedonato
- Applicant: Stephen D Del Prete , Robert Stratton , David A. Dedonato
- Applicant Address: US PA Berwyn
- Assignee: Tyco Electronics Corporation
- Current Assignee: Tyco Electronics Corporation
- Current Assignee Address: US PA Berwyn
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28F7/00 ; H01L23/34

Abstract:
A heat sink assembly is provided for a pluggable module. The heat sink assembly includes a heat sink having a module side and an end surface that intersects the module side. The module side is configured to thermally communicate with the pluggable module. A holder extends from the end surface of the heat sink. A thermal interface material (TIM) layer extends on the module side of the heat sink. The TIM layer is configured to engage the pluggable module. The TIM layer includes an end that is engaged between the end surface and the holder of the heat sink.
Public/Granted literature
- US20120127665A1 HEAT SINK ASSEMBLY FOR A PLUGGABLE MODULE Public/Granted day:2012-05-24
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