Invention Grant
- Patent Title: Stacked transducing devices
- Patent Title (中): 堆叠式换能装置
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Application No.: US12745749Application Date: 2008-12-03
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Publication No.: US08345513B2Publication Date: 2013-01-01
- Inventor: Yongli Huang
- Applicant: Yongli Huang
- Applicant Address: US CA San Jose
- Assignee: Kolo Technologies, Inc.
- Current Assignee: Kolo Technologies, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Lee & Hayes, PLLC
- International Application: PCT/US2008/085441 WO 20081203
- International Announcement: WO2009/073748 WO 20090611
- Main IPC: H04R19/00
- IPC: H04R19/00
Abstract:
Implementations include a capacitive micromachined ultrasonic transducer (CMUT) having an additional transducing device overlaid in a vertically stacked relationship. In some implementations the additional transducing device is a second CMUT configured to operate at a different frequency from the first CMUT.
Public/Granted literature
- US20100246332A1 Stacked Transducing Devices Public/Granted day:2010-09-30
Information query
