Invention Grant
- Patent Title: Seamless insert molding techniques
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Application No.: US12194471Application Date: 2008-08-19
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Publication No.: US08346183B2Publication Date: 2013-01-01
- Inventor: Christopher Prest , Erik Wang , Bradley Hamel , Phillip Michael Hobson
- Applicant: Christopher Prest , Erik Wang , Bradley Hamel , Phillip Michael Hobson
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Womble Carlyle Sandridge & Rice LLP
- Main IPC: H04M1/00
- IPC: H04M1/00 ; G06F1/16

Abstract:
Methods and apparatus for using an insert molding process to form a tactilely seamless overall part from component parts that are made from different materials are disclosed. According to one aspect of the present invention, a housing includes a first part formed from a first material and a second part formed from a second material that is of a different type than the first material. The first part includes a first external surface and a first bonding surface, and the second part includes a second external surface and a second bonding surface. The second bonding surface can be integrally bonded to the first bonding surface so that the first external surface and the second external surface form a gap-free overall surface.
Public/Granted literature
- US20100048257A1 Seamless Insert Molding Techniques Public/Granted day:2010-02-25
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