Invention Grant
US08346980B2 Modular input/output bridge system for semiconductor processing equipment
有权
用于半导体加工设备的模块化输入/输出桥接系统
- Patent Title: Modular input/output bridge system for semiconductor processing equipment
- Patent Title (中): 用于半导体加工设备的模块化输入/输出桥接系统
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Application No.: US12775258Application Date: 2010-05-06
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Publication No.: US08346980B2Publication Date: 2013-01-01
- Inventor: Ronald Vern Schauer
- Applicant: Ronald Vern Schauer
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Moser Taboada
- Agent Alan Taboada
- Main IPC: G06F3/00
- IPC: G06F3/00 ; H01L21/00

Abstract:
Apparatus and methods for providing an interface for a semiconductor processing tool are provided. In some embodiments, the apparatus may include an input/output bridge for receiving analog and state command system control signals from, and sending return data and status information to, a system controller, wherein the analog and state command system control signals are intended to control an analog device, and for converting the analog and state command system control signal into a digital system control signal intended to control a digital device; and an upper pneumatic assembly coupled to the input/output bridge for providing pressure control to one or more pressure zones located on a polishing apparatus coupled to the upper pneumatic assembly for the polishing of semiconductor wafers.
Public/Granted literature
- US20100285724A1 MODULAR INPUT/OUTPUT BRIDGE SYSTEM FOR SEMICONDUCTOR PROCESSING EQUIPMENT Public/Granted day:2010-11-11
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